Description
This standard outlines the performance and qualification requirements for rigid printed boards of all types, including single-sided, double-sided (with or without plated-through holes), multilayer with or without blind/buried vias and metal core boards.
The standard covers key areas such as final finishes, surface plating and coatings, conductor and via requirements, and the frequency of acceptance testing and quality checks. It also sets out the electrical, mechanical and environmental criteria that rigid boards must meet.
The latest revision F of IPC‑6012 includes several important updates on areas such as copper wrap plating, solderability testing, dewetting, internal plated layers and expanded guidance on board cavities.
